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Gold Bonding Ribbons Wire for Special Packaging Applications
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Manufacturer & Trading Company

Gold Bonding Ribbons Wire for Special Packaging Applications

USD 20.00 / g
Price varies by quantity and specifications
MOQ 1 g
Category Electronics
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Shenzhen Silver Technologies Ltd

China

Manufacturer & Trading Company
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Product Description

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Gold Bonding Ribbons Wire for Special Packaging Applications
Gold Bonding Ribbons Wire for Special Packaging Applications

Technical Specifications

Model NO.gold02
TypeBare
Conductor TypeAlloy
ApplicationEarphone
Conductor MaterialGold
Sheath MaterialNon
Insulation MaterialNon
Material ShapeFlat Wire
Range of ApplicationPackaging of Microwave and RF Module Chips
CertificationISO9001, CE, CCC, RoHS
BrandJnajna Dy
Width Size Factory±5%
Thickness Dimension Factory±10%
Gold Content99.99%
Shaft Dimensions0.5 Inch 2inch
Transport PackageBubble Chamber, Paper Box
Specification0.0125*0.05
TrademarkJNAJAN DY
OriginChina
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Gold Bonding Ribbons Wire for Special Packaging Applications
Gold Bonding Ribbons Wire for Special Packaging Applications
USD 20.00 / g
g