Manufacturer & Trading Company
Shenzhen Ponda Fully-Automatic Wafer Thinning Machine
USD 30000.00 – 50000.00
/ piece
Price varies by quantity and specifications
| MOQ | 1 piece |
| Category | Machinery |
19
Years
98%
Response
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Product Description
No detailed description available. Please send an inquiry for more information.
Technical Specifications
| Model NO. | 300 |
| After-sales Service | 12months |
| Warranty | 12months |
| Type | Surface Grinding Machine |
| Processing Object | Flat Workpieces |
| Abrasives | Grinding Wheel |
| Controlling Mode | PLC |
| Automatic Grade | Semiautomatic |
| Cylindrical Grinder Type | Surface Grinding Machine |
| Precision | High Precision |
| Certification | ISO 9001 |
| Condition | New |
| Power Source | Electricity |
| Working Style | High-Speed Universal |
| Variable Speed | with Variable Speed |
| Object | Wafer |
| Application | Electronic Technique |
| Disc(Wheel) Type | Thinning Machine |
| Transport Package | Ponda |
| Trademark | PONDA |
| Origin | China |