Manufacturer & Trading Company
Ultra Precision Fully Automatic Wafer Thinning Machine for Diamond Semiconductor Material
USD 280000.00 – 320000.00
/ piece
Price varies by quantity and specifications
| MOQ | 1 piece |
| Category | Machinery |
19
Years
98%
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Product Description
No detailed description available. Please send an inquiry for more information.
Technical Specifications
| Model NO. | 200A |
| After-sales Service | 12months |
| Warranty | 12months |
| Type | Surface Grinding Machine |
| Processing Object | Flat Workpieces |
| Abrasives | Grinding Wheel |
| Controlling Mode | PLC |
| Automatic Grade | Semiautomatic |
| Cylindrical Grinder Type | Surface Grinding Machine |
| Precision | High Precision |
| Certification | ISO 9001 |
| Condition | New |
| Power Source | Electricity |
| Working Style | High-Speed Universal |
| Variable Speed | with Variable Speed |
| Object | Wafer |
| Application | Electronic Technique |
| Disc(Wheel) Type | Chamfering Machine |
| Material | Metal and Non-Metal |
| Disc Diameter | 3/4/6-Inch 4/6/8-Inch |
| Weight | 4000kg |
| Applicable Wafer Size | 3/4/6-Inch 4/6/8-Inch |
| Wheel Diameter | Medium 205 mm |
| Wheel R. Speed | 500- 3000 Min-1 |
| Wheel Motor Power | 1kw |
| Max. Travserse Rate | 10 mm/S |
| in-Feed Resolution | 0.5μm/S |
| Transport Package | Wood Crate |
| Specification | 2500× 4500× 1800mm |
| Trademark | PONDA |
| Origin | China |