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Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
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Manufacturer & Trading Company

Ultra-Precision Wafer High Speed Grinding and Thinning Equipment

USD 20000.00 – 60000.00 / piece
Price varies by quantity and specifications
MOQ 1 piece
Category Machinery
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Shenzhen Ponda Grinding Technology Co.,Ltd.

China

Manufacturer & Trading Company
19
Years
98%
Response
24h
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Product Description

No detailed description available. Please send an inquiry for more information.

Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
Ultra-Precision Wafer High Speed Grinding and Thinning Equipment

Technical Specifications

Model NO.FD220
After-sales Service12months
Warranty12months
TypeSurface Grinding Machine
Processing ObjectFlat Workpieces
AbrasivesGrinding Wheel
Controlling ModePLC
Automatic GradeSemiautomatic
Cylindrical Grinder TypeSurface Grinding Machine
PrecisionHigh Precision
CertificationISO 9001
ConditionNew
Power SourceElectricity
Disc(Wheel) TypeGrinding Disc
Variable Speedwith Variable Speed
ApplicationSemiconductor Industry
ServiceOversea Setup & After-Sale Avalaible
ClassThinner
Process Station1
AbrasiveRecyclable Water & Grinding Wheel
Wheel Rotate Speed0-3000 Rpm
Workpiece Accuracy Control(Parallelism)1um
Power of Grinding Wheel Motor5.5kw
Transport PackageWood Crate
TrademarkPONDA
OriginChina
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Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
USD 20000.00 / piece
piece