Manufacturer & Trading Company
High-Precision Automatic Epoxy Die Bonder for Multi-Chip Placement Packaging
USD 135000.00 – 200000.00
/ piece
Price varies by quantity and specifications
| MOQ | 1 piece |
| Category | Machinery |
12
Years
98%
Response
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Product Description
No detailed description available. Please send an inquiry for more information.
Technical Specifications
| Model NO. | MDRB DB561 |
| After-sales Service | 2 Year |
| Condition | New |
| Speed | High Speed |
| Precision | High Precision |
| Certification | CE |
| Warranty | 12 Months |
| Automatic Grade | Automatic |
| Type | High-speed Chip Mounter |
| Transport Package | Wooden Crate |
| Specification | 900kg |
| Trademark | minder-hightech |
| Origin | China |