Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
THE COMPANY
Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
| Business Type | Manufacturer & Trading Company |
| Year Established | 2013 |
| Total Employees | 182 |
| Capabilities | ODM,OEM,OBM,Sample |
| Trade Terms | FOB,EXW,CIF |
| Country | China |
| Address | Floor 1-2, Building B, Jingang Science Park, Qiaotou Community, Fuyong Street, Baoan District, Shenzhen, Guangdong, China |
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