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Precision Single-Lapping Machine for Diamond Wafers
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Manufacturer & Trading Company

Precision Single-Lapping Machine for Diamond Wafers

USD 133800.00 / set
Price varies by quantity and specifications
MOQ 1 set
Category Machinery
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Hefei Sheng Hai Rong Machinery Co.,Ltd

China

Manufacturer & Trading Company
8
Years
98%
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Product Description

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Precision Single-Lapping Machine for Diamond Wafers
Precision Single-Lapping Machine for Diamond Wafers

Technical Specifications

Model NO.VRG-250F
After-sales Serviceon-Line Support
Warranty1 Year
TypeSpecial Purpose Grinding Machine
Processing ObjectWafers
AbrasivesGrinding Wheel
Controlling ModeCNC
Automatic GradeAutomatic
PrecisionHigh Precision
CertificationCE, ISO 9001
ConditionNew
Wheel Size203(Od)mm Cup Type
Max Work Piece Size200mm
Resolution0.0001 mm
Accuracy±0.001 mm
Travel Length100mm
Repeatability±0.001 mm
Transport PackageSea Shipment
Specification1250(W) X 1090(D) X 1970(H)
TrademarkSHR
HS Code8486109000
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Precision Single-Lapping Machine for Diamond Wafers
Precision Single-Lapping Machine for Diamond Wafers
USD 133800.00 / set
set