Jiangsu Himalaya Semiconductor Co., Ltd.
China
China
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting
| Business Type | Manufacturer & Trading Company |
| Year Established | 2019 |
| Capabilities | OEM,ODM |
| Trade Terms | FOB,CIF,CFR,EXW |
| Country | China |
| Address | Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China |
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No active products listed yet.
| Location | China |
| Year Est. | 2019 |
| Business Type | Manufacturer & Trading Company |
| Products | 0 active listings |