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High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
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Manufacturer & Trading Company

High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder

USD 5000.00 – 70000.00 / piece
Price varies by quantity and specifications
MOQ 1 piece
Category Machinery
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Jiangsu Himalaya Semiconductor Co., Ltd.

China

Manufacturer & Trading Company
7
Years
98%
Response
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Product Description

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High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder

Technical Specifications

Model NO.H580PLUS
After-sales Service1 Year
FunctionAnti-Corrosion
DemouldingWire Bonding
ConditionNew
CertificationCCC, PSE, FDA, RoHS, ISO, CE
Warranty12 Months
Automatic GradeAutomatic
InstallationVertical
Driven TypeElectric
Mould Life>1,000,000 Shots
Max Bonding AreaX: 56mm, Y: 80mm
Positioning Accuracy±3μm (@3
Bonding Cycle Time45ms/Wire
Wire Diameter RangeDia 15 to 50 Micron
Drive SystemLinear Motor (Direct Drive)
Repeatability±3μm (@3σ)
Magazine CompatibilityL: 100 to 275mm, W: 30 to 90mm, H: 180mm
Dimensions (W×D×H)985mm × 960mm × 1770mm
Transport PackageInternational Trade Standard
Specification985mm*960mm*1770mm
TrademarkHimalaya
OriginChina
HS Code8486402200
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High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
USD 5000.00 / piece
piece