High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
USD 500000.00 – 1000000.00
MOQ 1 set
Machinery
AT A GLANCESupplier details
19Active products
2019Year established
Manufacturer & Trading CompanyBusiness type
Details from supplier profile
SUPPLIER STORE / China
Manufacturer & Trading Company
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting
China
·Established 2019
FACTORY & FACILITIES
THE COMPANY
A supplier for your
next project.
at a glance
Company Profile
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting
| Business Type | Manufacturer & Trading Company |
| Year Established | 2019 |
| Main Categories | Machinery, Packaging & Printing |
| Capabilities | OEM,ODM |
| Trade Terms | FOB,CIF,CFR,EXW |
| Country | China |
| Address | Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China |
| Products | 19 active listings |
INSIDE THE FACILITY — 5 PHOTOS
Factory & facilities.
High End Semiconductor Fully Automatic LLO Laser Peeling Equipment
USD 1000000.00 – 2000000.00
MOQ 1 set
Machinery
High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
USD 40000.00 – 100000.00
MOQ 1 piece
Machinery
Fully Automatic Semiconductor Glue Coating and Developing Equipment
USD 10000.00 – 50000.00
MOQ 1 piece
Machinery
Precision Laser Cutting Technology for LED Wafer Production
USD 500000.00 – 1000000.00
MOQ 1 set
Machinery
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
USD 100000.00 – 1000000.00
MOQ 1 set
Machinery
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
USD 100000.00 – 1000000.00
MOQ 1 set
Machinery
Automatic IC Reel Packaging Machine for Semiconductor Efficiency
USD 40000.00 – 100000.00
MOQ 1 piece
Packaging & Printing
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