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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
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Manufacturer & Trading Company

High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device

USD 100000.00 – 1000000.00 / set
Price varies by quantity and specifications
MOQ 1 set
Category Machinery
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Jiangsu Himalaya Semiconductor Co., Ltd.

China

Manufacturer & Trading Company
7
Years
98%
Response
24h
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Product Description

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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device

Technical Specifications

Model NO.Himalaya-26
After-sales Service7*24 Hours
FunctionHigh Temperature Resistance
DemouldingAutomatic
ConditionNew
CertificationISO
Warranty12 Months
Automatic GradeAutomatic
InstallationDesktop
Driven TypeElectric
Mould Life>1,000,000 Shots
X-Y Table105×105mm Stroke
Z-Axis120° Rotation
Splitting Yield≥99.5%
Equipment Uptime≥95%
Mean Repair Time≤12 Hours
Machine Dimensions1650×1200×1700mm (W×D×H)
Power Supply220V, 50Hz, 10A
AlignmentCCD Auto-Alignment
Transport PackageCrate
SpecificationStandard Specifications
TrademarkHimalaya
OriginChina
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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
USD 100000.00 / set
set