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Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
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Manufacturer & Trading Company

Fully Automatic Laser Grooving Equipment for Semiconductor Wafers

USD 50000.00 – 100000.00 / piece
Price varies by quantity and specifications
MOQ 1 piece
Category Machinery
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Jiangsu Himalaya Semiconductor Co., Ltd.

China

Manufacturer & Trading Company
7
Years
98%
Response
24h
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Product Description

No detailed description available. Please send an inquiry for more information.

Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers

Technical Specifications

Model NO.Himalaya-6688
After-sales ServiceProvided
FunctionHigh Temperature Resistance, Laser Grooving
DemouldingNo
ConditionNew
CertificationRoHS, ISO, CE
Warranty12 Months
Automatic GradeAutomatic
InstallationVertical
Driven TypeElectric
Mould LifeLaser Warranty for One Year
Product NameLaser Grooving Equipment
Feature 1High Precision
Feature 2High Efficiency
OEM/ODM ServiceProvided
Transport PackageComplies with International Logistics Standards
Specification1400 x2400x 2440 (including tricolor light)
TrademarkHimalaya
OriginChina
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Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
USD 50000.00 / piece
piece