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High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
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Manufacturer & Trading Company

High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate

USD 500000.00 – 1000000.00 / set
Price varies by quantity and specifications
MOQ 1 set
Category Machinery
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Jiangsu Himalaya Semiconductor Co., Ltd.

China

Manufacturer & Trading Company
7
Years
98%
Response
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Product Description

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High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate

Technical Specifications

Model NO.Himalaya-34
After-sales Service7*24 Hours
FunctionHigh Temperature Resistance
DemouldingAutomatic
ConditionNew
CertificationISO, CE
Warranty6 Months
Automatic GradeAutomatic
InstallationDesktop
Driven TypeElectric
Mould Life>1,000,000 Shots
Product NameFully Automatic Molding Equipment
Power SupplyAC 380V, 50/60Hz, 11 Kw
Humidity Range50%-75%
OEM/ODM ServiceProvided
Equipment Dimensions (L×W×H)1340 × 1775 × 2100 mm
Dimensions with Door Open (L×W×H)1810 × 3300 × 2100mm
Equipment Weight2 Tons
Temperature Range22-28c
Transport PackageStandard Wooden Pack
SpecificationStandard Specifications
TrademarkHimalaya
OriginChina
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High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
High End Fully Automatic Semiconductor Molding Equipment for Lead Frame/Substrate
USD 500000.00 / set
set