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Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
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Manufacturer & Trading Company

Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers

USD 70000.00 – 100000.00 / set
Price varies by quantity and specifications
MOQ 1 set
Category Machinery
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Jiangsu Himalaya Semiconductor Co., Ltd.

China

Manufacturer & Trading Company
7
Years
98%
Response
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Product Description

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Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers

Technical Specifications

Model NO.Himalaya-6688-11
After-sales ServiceSupport Online Training and on-Site Equipment Tech
FunctionComplies with Semiconductor Industry Technical Sta
DemouldingAutomatic
ConditionNew
CertificationISO, CE
Warranty12 Months
Automatic GradeAutomatic
InstallationVertical
Driven TypeElectric
Mould Life8000h
WavelengthUltraviolet
Output Power< 20 W
Repetition Rate0 - 200 kHz
Wafer Sizes4", 6", 8"
Wafer Thickness50 to 750 Micron
Max. Processing Speed1000 mm/S
X/Y Positioning Accuracy± 1 Um
Rotation Angle210°
Platform Flatness≤ ± 5 Um (Within 200 mm)
Transport PackageComplies with International Logistics Standards
Specification1400 x2400x 2440 (including tricolor light)
TrademarkHimalaya
OriginChina
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Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
USD 70000.00 / set
set