Manufacturer & Trading Company
Fully Automatic Semiconductor Glue Coating and Developing Equipment
USD 10000.00 – 50000.00
/ piece
Price varies by quantity and specifications
| MOQ | 1 piece |
| Category | Machinery |
7
Years
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Product Description
No detailed description available. Please send an inquiry for more information.
Technical Specifications
| Model NO. | Himalaya-27 |
| After-sales Service | Provided |
| Function | High Temperature Resistance |
| Demoulding | Automatic |
| Condition | New |
| Certification | RoHS, ISO, CE |
| Warranty | 12 Months |
| Automatic Grade | Automatic |
| Installation | Desktop |
| Driven Type | Electric |
| Mould Life | >1,000,000 Shots |
| Wafer Sizes Supported | 150mm, 200mm, 300mm |
| Compatible Materials | Photoresist, Polyimide, Spin-on Dielec |
| Viscosity Range | 15 to 50, 000 Cp |
| Coating Thickness Range | 0.5 to 500 Micron |
| Uniformity | ≤±1.5% (3σ) |
| Defect Density | <0.1 Particles/Cm² (>0.2μm) |
| <0.1 Particles/Cm² (>0.2μm) | ±0.2°C (Across 7-Zone Hot Plate) |
| Throughput | up to 200 Wph (200mm) |
| Automation | Secs/Gem Compliance for Fab Integration |
| Integration | Automated Wafer Handling |
| Transport Package | Customized or Wooden Box Packaging |
| Specification | Standard Specifications |
| Trademark | Himalaya |
| Origin | China |